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Publications

  1. A. H. Kalhori, T. Kim, W. S. Kim, “Enhanced RF Response of 3D Printed Wireless LC Sensors using Dielectrics with High Permittivity”, Flexible and Printed Electronics, (2023). DOI

  2. S. NajafiKhoshnoo, T. Kim, J. A. Tavares-Negrete, X. Pei, P. Das, S. W. Lee, J. Rajendran, and R. Esfandyarpour, “A 3D Nanomaterials-Printed Wearable, Battery-free, Biocompatible, Flexible, and Wireless pH Sensor System for Real-Time Health Monitoring”, Advanced Materials Technologies, 2201655 (2023). DOI

  3. T. Kim, A. H. Kalhori, C. Bao, T. Kim, and W. S. Kim, “3D Designed Battery-free Wireless Origami Pressure Sensor”, Microsystems & Nanoengineering, (2022). DOI

  4. Qian Yi, S. Najafikhoshnoo, P. Das, S. Noh, E. Hoang, T. Kim, and Rahim Esfandyarpour, “All-3D-Printed, Flexible, and Hybrid Wearable Bioelectronic Tactile Sensors Using Biocompatible Nanocomposites for Health Monitoring”, Advanced Materials Technologies, 2101034 (2021). DOI

  5. T. Kim, Qian Yi, Emily Hoang, and Rahim Esfandyarpour, “A 3D Printed Wearable Bioelectronic Patch for Multi-Sensing and In Situ Sweat Electrolyte Monitoring” Advanced Materials Technologies, 2001021 (2021). DOI Highlighted as the Frontispiece

  6. T. Kim, M. Kaur, and W. S. Kim, “Humanoid Robot Actuation through Precise Chemical Sensing Signals” Advanced Materials Technologies, 1900570 (2019). DOI Selected as a Journal Front Cover

  7. T. Kim, C. Bao, M. Hausmann, G. Siqueira, T. Zimmermann, and W. S. Kim, “3D Printed Disposable Wireless Ion Sensors with Biocompatible Cellulose Composites” Advanced Electronic Materials 5, pp. 1800778 (2019). DOI Selected as a Journal Front Cover

  8. T. Kim, R. Trangkanukulkij, and W. S. Kim, “Nozzle Shape Guided Filler Orientation in 3D Printed Photo-curable Nanocomposites” Scientific Reports, 8, pp. 3805 (2018). DOI

  9. J. Park, T. Kim and W. S. Kim, “Conductive Cellulose Composites with Low Percolation Threshold for 3D Printed Electronics” Scientific Reports, 7, pp. 3246 (2017). DOI

  10. L. Jian, T. Kim, J. Park, J. Wang, and W. S. Kim, “High Performance 3D Printed Electronics Using Electroless Plated Copper” AIP Advances 7, pp. 035314 (2017). DOI

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